underfill

基本解释

DU901 is a one component, epoxy encapsulant designed for use as a repairable underfill resin for CSP or BGA.
简介：道尔DU901是一种单组分环氧密封剂，用于CSP或BGA底部填充制程。
T hen show that correct underfill can dramatically increase thermal reliability.
通过正确的底部填充，可提高倒装芯片组装的成品率和可靠性。
This makes complete sense, and it is followed by a picture of a modern chip with the bumps and underfill pointed out.
这使得完整意义上说，这是其次的图片现代芯片的颠簸和底层指出。
The results show that the residual moisture within underfill materials enhances the stress level in solder joint.
结果表明：在湿热环境下，底充胶材料内部残留的湿气提高了焊点的应力水平。
A cure-dependent viscoelastic model was applied to describe the mechanical behavior of underfill.
利用有限元仿真的方法，模拟了无铅倒装封装器件封装的工艺及可靠性测试。