wafer-level
基本解释
- n.圆片级
英汉例句
- One should cover the resistance with metal layer, to avoid the damaged during the wafer level testing.
用金属覆盖电阻,避免wafer级测试时的损伤。 - Structure designing and key processing technologies for wafer level package(WLP) were studied.
对圆片级封装(WLP)的结构设计和关键工艺技术进行了研究; - Electrostatic bonding is an important encapsulating means for the materials at the chip or wafer level.
静电键合是片状材料封接的一种重要手段，讨论了玻璃在电场作用下的键合过程。 - Research of gold bump for wafer level package
用于圆片级封装的金凸点研制 - Ultrathin Wafer Level Chip Size Package Technology
超薄型圆片级芯片尺寸封装技术